Ukukhiqizwa kwezibonisi ze-LED ezinephimbo elincane kuhilela lezo zinqubo zobuchwepheshe

Ukukhiqizwa kwezibonisi ze-LED ezinephimbo elincane kuhilela lezo zinqubo zobuchwepheshe

1.Ubuchwepheshe bokupakisha

Izibonisi ze-LED ezine-pitch encanengokuminyana ngezansiP2ngokuvamile sebenzisa amalambu angu-0606, 1010, 1515, 2020, 3528, futhi umumo wezikhonkwane ze-LED yi-J noma iphakheji ye-L.Uma izikhonkwane ziboshwe emaceleni, kuzoba khona ukubonakaliswa endaweni yokushisela, futhi umphumela wombala uyinki uzoba mpofu.Kuyadingeka ukwengeza imaski ukuthuthukisa umehluko.Uma ukuminyana kuphinde kwandiswa, iphakheji ye-L noma ye-J ayikwazi ukuhlangabezana nezidingo zesicelo, futhi iphakheji ye-QFN kufanele isetshenziswe.Isici sale nqubo ukuthi azikho izikhonkwane eziboshwe eceleni, futhi indawo ye-welding ayibonakali, okwenza umphumela wokunikeza umbala ube muhle kakhulu.Ngaphezu kwalokho, idizayini edidiyelwe emnyama yonke ibunjwa ngokubunjwa, futhi umehluko wesikrini ukhuphuka ngo-50%, futhi ikhwalithi yesithombe yohlelo lokusebenza lokubonisa ingcono kunaleyo yesibonisi sangaphambilini.

2.Ubuchwepheshe bokukhweza:

Ukususwa kancane kokuma kwedivayisi ngayinye ye-RGB kusibonisi se-micro-pitch kuzoholela ekubonisweni okungalingani esikrinini, okubophezelekile ukuthi kudinge okokusebenza kokubeka ukuthi kube nokunemba okuphezulu.

3. Inqubo yokushisela:

Uma izinga lokushisa le-reflow soldering likhuphuka ngokushesha kakhulu, kuzoholela ekumanzini okungalingani, okuzokwenza nakanjani idivayisi igudluke phakathi nenqubo yokumanzisa okungenakulinganisela.Ukuzungeza komoya okweqile nakho kungabangela ukugudluka kocingo.Zama ukukhetha umshini we-reflow soldering onezindawo zokushisa ezingaphezu kwezingu-12, isivinini seketango, ukuphakama kwezinga lokushisa, umoya ojikelezayo, njll. njengezinto eziqinile zokulawula, okungukuthi, ukuhlangabezana nezidingo zokuthembeka kwe-welding, kodwa futhi ukunciphisa noma ukugwema ukuxoshwa izingxenye, bese uzama ukuyilawula ngaphakathi kobubanzi besidingo.Ngokuvamile, u-2% wokuphakama kwephikseli usetshenziswa njengenani lokulawula.

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4. Inqubo yebhodi lesifunda ephrintiwe:

Ngokuthambekela kokuthuthukiswa kwezikrini ze-micro-pitch display, kusetshenziswa amabhodi angu-4-layer kanye no-6-layer, futhi ibhodi lesifunda eliphrintiwe lizokwamukela ukuklanywa kwama-vias amahle kanye nezimbobo ezigqitshiwe.Ubuchwepheshe bokubhoboza ngomshini ngeke busakwazi ukuhlangabezana nezidingo, futhi ubuchwepheshe bokumba i-laser obuthuthukisiwe buzohlangabezana nokucutshungulwa kwemigodi emincane.

5. Ubuchwepheshe bokuphrinta:

Idizayini efanele yephedi ye-PCB idinga ukuxhumana nomkhiqizi futhi isetshenziswe ekwakhiweni.Ukuthi usayizi wokuvula we-stencil kanye nemingcele yokuphrinta efanele ihlobene ngokuqondile nenani le-solder paste ephrintiwe.Ngokuvamile, amadivayisi angu-2020RGB asebenzisa ama-stencil e-laser acwebezelisiwe anogqinsi luka-0.1-0.12mm, kanye nogqinsi oluwu-1.0-0.8 lunconywa kumadivayisi angaphansi kuka-1010RGB.Ukuqina nosayizi wokuvula kukhuphuka ngokulingana nenani likathayela.Izinga le-micro-pitch LED soldering lihlobene eduze nokuphrinta kokunamathisela kwe-solder.Ukusetshenziswa kwamaphrinta asebenzayo anokubona ukushuba kanye nokuhlaziywa kwe-SPC kuzodlala indima ebalulekile ekuthembekeni.

6. Ukuhlanganiswa kwesikrini:

Ibhokisi elihlanganisiwe lidinga ukuqoqwa esikrinini ngaphambi kokuthi libonise izithombe namavidiyo acolisisiwe.Kodwa-ke, ukubekezelela kohlangothi kwebhokisi ngokwalo kanye nokubekezelela okukhulayo komhlangano akukwazi ukuzitshwa ngomphumela wokuhlanganisa wesibonisi se-micro-pitch.Uma ukuphakama kwephikseli kwedivayisi eseduze phakathi kwekhabethe nekhabethe kukhulu kakhulu noma kuncane kakhulu, imigqa emnyama nemigqa ekhanyayo izoboniswa.Inkinga yemigqa emnyama nemigqa ekhanyayo iyinkinga engeke ishaywe indiva futhi idinga ukuxazululwa ngokushesha ezikrinini zokubonisa iphimbo elincane njengeP1.25.Ezinye izinkampani zenza izinguquko ngokunamathisela itheyiphu engu-3m ​​futhi zilungise kahle inathi lebhokisi ukuze kuzuzwe umphumela omuhle kakhulu.

7. Ukuhlanganiswa kwebhokisi:

Ikhabethe lenziwe ngamamojula ahlukene ahlanganiswe ndawonye.I-flatness yekhabhinethi kanye negebe phakathi kwamamojula ahlobene ngokuqondile nomphumela jikelele wekhabhinethi ngemva komhlangano.Ibhokisi lokucubungula ipuleti le-Aluminium kanye nebhokisi le-aluminium eliphonswe yizinhlobo zamabhokisi asetshenziswa kakhulu njengamanje.Ukucaba kungafinyelela phakathi kwezintambo eziyi-10.Igebe lokuhlukanisa phakathi kwamamojula lihlolwa ngebanga eliphakathi kwamaphikseli aseduze amamojula amabili.imigqa, amaphikseli amabili kude kakhulu azoholela emigqeni emnyama.Ngaphambi kokuhlanganisa, kuyadingeka ukukala nokubala ukuhlangana kwemodyuli, bese ukhetha ishidi lensimbi eliwugqinsi oluhlobene njengento okufanele ifakwe kusengaphambili ukuze ihlanganiswe.


Isikhathi sokuthumela: May-13-2022

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