Ukuveliswa kwemiboniso ye-LED encinci ye-pitch ibandakanya ezo nkqubo zobugcisa
1.Iteknoloji yokupakisha
Iziboniso ze-LED ezincincingokuxinana ngaphantsiP2sebenzisa ngokubanzi 0606, 1010, 1515, 2020, 3528 izibane, kunye nemilo yezikhonkwane ze-LED yi-J okanye iphakheji ye-L.Ukuba izikhonkwane zifakwe emacaleni, kuya kubakho ukubonakaliswa kwendawo ye-welding, kwaye umphumo wombala we-inki uya kuba mbi.Kuyimfuneko ukongeza imaski ukuphucula umahluko.Ukuba uxinaniso luyanda ngakumbi, iphakheji ye-L okanye ye-J ayikwazi ukuhlangabezana neemfuno zesicelo, kwaye iphakheji ye-QFN mayisetyenziswe.Uphawu lwale nkqubo kukuba akukho zikhonkwane ezidibeneyo ezidibeneyo, kwaye indawo ye-welding ayibonakali, eyenza umphumo wokunikezela umbala ube mhle kakhulu.Ukongeza, idizayini edibeneyo emnyama yonke ibunjwe ngokubumba, kwaye ukuchasana kwesikrini kwanda nge-50%, kwaye umgangatho womfanekiso wesicelo sokubonisa ungcono kunomboniso wangaphambili.
2.Itekhnoloji yokunyuka:
I-offset encinci yesikhundla sesixhobo ngasinye se-RGB kwi-micro-pitch display iya kubangela umboniso ongalinganiyo kwisikrini, esibophelelwe ukuba sifune izixhobo zokubeka ukuba zibe nokuchaneka okuphezulu.
3. Inkqubo yeWelding:
Ukuba ukushisa kwe-reflow soldering kuphakama ngokukhawuleza, kuya kubangela ukumanzisa okungalinganiyo, okuya kubangela ukuba isixhobo sitshintshe ngexesha lenkqubo yokumanzisa okungalinganiyo.Ukujikeleza komoya okugqithisileyo nako kunokubangela ukufuduswa kwesixhobo.Zama ukukhetha umatshini we-reflow soldering onemimandla yobushushu engaphezulu kwe-12, isantya sekhonkco, ukunyuka kwamaqondo obushushu, umoya ojikelezayo, njl njl njengezinto ezingqongqo zokulawula, oko kukuthi, ukuhlangabezana neemfuno zokuthembeka kwe-welding, kodwa nokunciphisa okanye ukuphepha ukufuduka. amalungu, kwaye uzame ukuyilawula ngaphakathi kobubanzi bemfuno.Ngokubanzi, i-2% yepixel pitch isetyenziswa njengexabiso lolawulo.
4. Inkqubo yebhodi yesekethe eprintiweyo:
Ngomgangatho wophuhliso lwezikrini ze-micro-pitch display screens, i-4-layer kunye ne-6-layer board zisetyenziswa, kwaye ibhodi yesekethe eprintiweyo iya kwamkela uyilo lwe-vias emihle kunye nemingxuma engcwatywe.Itekhnoloji yokomba oomatshini ayinakukwazi ukuhlangabezana neemfuno, kwaye iteknoloji yokugaya i-laser ephuhliswe ngokukhawuleza iya kuhlangabezana nokucutshungulwa komngxuma omncinci.
5. Itekhnoloji yoshicilelo:
Uyilo oluchanekileyo lwephedi yePCB kufuneka kwaziswe umenzi kwaye luphunyezwe kuyilo.Ingaba ubungakanani bokuvula be-stencil kunye neeparitha ezichanekileyo zokushicilela zihambelana ngokuthe ngqo nomthamo we-solder paste eprintiweyo.Ngokubanzi, izixhobo ze-2020RGB zisebenzisa i-electro-polished laser stencils ezinobunzima obuyi-0.1-0.12mm, kunye ne-1.0-0.8 ubukhulu beestencil ziyacetyiswa kwizixhobo ezingaphantsi kwe-1010RGB.Ukutyeba kunye nobukhulu bokuvula ukwanda ngokomlinganiselo wesixa setoti.Umgangatho we-micro-pitch LED soldering inxulumene ngokusondeleyo nokuprinta kwe-solder paste.Ukusetyenziswa kweeprinta ezisebenzayo kunye nokufumanisa ubukhulu kunye nohlalutyo lwe-SPC luya kudlala indima ebalulekileyo ekuthembekeni.
6. Ukudibanisa isikrini:
Ibhokisi edityanisiweyo kufuneka idityaniswe kwiscreen ngaphambi kokuba ibonise imifanekiso esulungekileyo kunye neevidiyo.Nangona kunjalo, ukunyamezela kwe-dimensional yebhokisi ngokwayo kunye nokunyamezela okuhlangeneyo kwendibano akunakuhoywa ngenxa yempembelelo yendibano ye-micro-pitch display.Ukuba i-pixel pitch yesixhobo esikufutshane phakathi kwekhabhathi kunye nekhabhathi inkulu kakhulu okanye incinci kakhulu, imigca emnyama kunye nemigca eqaqambileyo iya kuboniswa.Ingxaki yemigca emnyama kunye nemigca eqaqambileyo yingxaki engenakuhoywa kwaye idinga ukusonjululwa ngokukhawuleza kwizikrini zokubonisa i-micro-pitch ezinjeP1.25.Ezinye iinkampani zenza uhlengahlengiso ngokunamathela kwi-tape ye-3m kunye nokulungelelanisa kakuhle i-nut yebhokisi ukufezekisa umphumo ongcono.
7. Ukudibanisa ibhokisi:
Ikhabhinethi yenziwe ngeemodyuli ezahlukeneyo ezidityanisiweyo.I-flatness yekhabhinethi kunye nekhefu phakathi kweemodyuli zihambelana ngokuthe ngqo nomphumo jikelele wekhabhinethi emva kokuhlanganisana.Ibhokisi yokulungisa ipleyiti yeAluminiyam kunye nebhokisi ye-aluminium ephosiweyo zezona ntlobo zebhokisi zisetyenziswa kakhulu ngoku.I-flatness inokufikelela ngaphakathi kweengcingo ezili-10.Umsantsa wokudibanisa phakathi kweemodyuli uvavanywa ngumgama phakathi kweepikseli ezikufutshane zeemodyuli ezimbini.imigca, ipixels ezimbini kude kakhulu ziya kubangela imigca emnyama.Ngaphambi kokudibanisa, kuyimfuneko ukulinganisa kunye nokubala ukudibanisa kwemodyuli, kwaye emva koko ukhethe ishidi lesinyithi lobunzima obusondeleyo njengento yokufakwa kwangaphambili kwindibano.
Ixesha lokuposa: May-13-2022