Kwintsimi ye-high-definition-high-definition ye-RGB i-chips yokubonisa, i-front-mount, i-flip-chip kunye nezakhiwo ezithe nkqo "ziintsika ezintathu", phakathi kwazo i-sapphire ye-front-mount kunye ne-flip-chip izakhiwo zixhaphake kakhulu, kwaye izakhiwo ezithe nkqo zihlala zibhekisela kumncinci. -ifilimu ze-LED chips eziye zahluthwa kwi-substrate.I-substrate entsha inokulungiswa okanye i-substrate isenokungabotshwa ukwenza itshiphu ethe nkqo.
Ngokuhambelana nezikrini zokubonisa ezinemivalo eyahlukeneyo, iingenelo kunye nokungalunganga kwe-front-mount, i-flip-chip kunye nezakhiwo ezithe nkqo zahlukile, kodwa kungakhathaliseki ukuba kuthelekiswa nesakhiwo sentaba yangaphambili okanye i-flip-chip structure, iinzuzo zesakhiwo esithe nkqo kwezinye. imiba icacile.
I-P1.25-P0.6: Iinzuzo ezine zivelele
I-Lattice ithelekise ukusebenza kweetshiphusi ze-Lattice ezithe nkqo ze-5×5mil kunye ne-JD esesikweni ye-5×6mil chips ngokusebenzisa imifuniselo.Iziphumo zingqina ukuba xa kuthelekiswa neechips ezixhonywe ngaphambili, iitshiphusi ezithe nkqo azinakukhanya kwecala ngenxa yokukhanya okusecaleni.Kukho uphazamiseko oluncinci lokukhanya njengoko isithuba sisincinci.Ngamanye amazwi, okukhona inowuthi incinci, kokukhona ilahleko yokuqaqamba.Ke ngoko, iitshiphusi ezithe nkqo zineengenelo ezicacileyo kukuqina okukhanyayo kwaye zibonise ukucaca kwiindawo ezincinci.
Ngokukodwa, i-chip ethe nkqo inokukhanya okukhanyayo okukhanyayo, ukukhutshwa kokukhanya okufanayo, ukusabalalisa ukukhanya okulula, kunye nokusebenza kakuhle kokutshatyalaliswa kobushushu, ngoko umphumo wokubonisa ucacile;ukongeza, isakhiwo se-electrode esithe nkqo, ukuhanjiswa kwangoku kufana ngakumbi, kwaye ijika le-IV liyahambelana.I-electrode ikwicala elifanayo, kukho ukuvaleka kwangoku, kwaye ukufana kwendawo yokukhanya kubi.Ngokubhekiselele kwimveliso yemveliso, ulwakhiwo oluthe nkqo lunokugcina iingcingo ezimbini xa kuthelekiswa nolwakhiwo oluqhelekileyo olusesikweni, kwaye indawo yokubiyela kwisixhobo yanele ngokwaneleyo, enokwandisa ngokufanelekileyo umthamo wemveliso wesixhobo kunye nokunciphisa izinga lesiphene lesixhobo. kwintambo yokudibanisa ngokomyalelo wobukhulu.
In bonisa izicelo,into ethi "caterpillar" ibisoloko iyingxaki enkulu kubavelisi, kwaye eyona nto ibangela le ngxaki kukufuduka kwesinyithi.Ukufuduka kwesinyithi kunxulumene ngokusondeleyo nobushushu, ukufuma, umahluko onokubakho kunye nemathiriyeli ye-electrode yechip, kwaye kunokwenzeka ukuba ibonakale kumboniso onesandi esincinci.Isakhiwo esipheleleyo se-chip esime nkqo sineenzuzo zendalo ekusombululeni ukufuduka kwesinyithi.
Okokuqala, umgama phakathi kwezibonda ezilungileyo kunye ezimbi ze-chip yesakhiwo esithe nkqo mkhulu kune-135 μm.Ngenxa yomgama omkhulu phakathi kwezibonda ezintle nezimbi kwindawo ebonakalayo, nokuba kuyenzeka ukufuduka kwe-ion yesinyithi, ubomi bentsimbi yesibane setshiphu ethe nkqo bunokuba ngaphezulu kwamaxesha ama-4 kunolo lwetshiphu ethe tye, ephucula kakhulu ukuthembeka kwemveliso. kunye nokuzinza.Kungcono kwiumboniso oguquguqukayo.Okwesibini kukuba umphezulu we-blue-green chip kunye nesakhiwo esithe nkqo yi-electrode yensimbi e-Ti / Pt / Au, enzima ukuba ukufuduka kwesinyithi kwenzeke, kwaye ukusebenza kwayo okuphambili kufana nokubomvu. -itshiphu ethe nkqo ukukhanya.Okwesithathu kukuba i-chip yesakhiwo esithe nkqo isebenzisa iglue yesilivere, ene-conductivity enhle ye-thermal, kwaye iqondo lokushisa ngaphakathi kwesibane lingaphantsi kakhulu kunolo lofakelo olusemthethweni, olunokunciphisa kakhulu isantya sokufuduka kweeoni zetsimbi.
Ngeli nqanaba, kwisicelo se-P1.25-P0.9, nangona isisombululo esiqhelekileyo sangaphambili sithatha imarike enkulu ngenxa yenzuzo yexabiso eliphantsi, i-flip-chip kunye nezisombululo ezichanekileyo zidlala indima enkulu kwizicelo eziphezulu. ekusebenzeni kwabo okuphezulu.Ngokweendleko, ixabiso leqela le-RGB chips kwisisombululo esithe nkqo yi-1/2 yesisombululo se-flip-chip, ngoko ke ukusebenza kweendleko zesakhiwo esithe nkqo kuphezulu.
Kwizicelo ze-P0.6-P0.9mm, izisombululo eziqhelekileyo zokunyuka kwe-front-mount zilinganiselwe ngumda wendawo ebonakalayo, kunzima ukuqinisekisa isivuno, kwaye amathuba okuvelisa ngobuninzi aphantsi, ngelixa i-flip-chip kunye nezisombululo ze-chip ezithe nkqo zinokuhlangabezana iimfuno.Kufanelekile ukuqaphela ukuba, kumzi-mveliso wokupakisha, kuyimfuneko yokongeza isixa esikhulu sezixhobo zokwamkela iskimu sesakhiwo se-flip-chip, kwaye ngenxa yokuba iipads ezimbini ze-flip-chip zincinci kakhulu, isantya sesivuno se-solder paste. ukuwelda ayikho phezulu, kunye nokuvuthwa inkqubo ukupakishwa nkqo chip scheme High, ukupakisha ekhoyo
Izixhobo zasefektri zinokusetyenziswa ngokufanayo, kwaye iindleko zeseti ye-RGB yeetshiphusi ezithe nkqo sisiqingatha kuphela seseti ye-RGB yee-flip-chips, kwaye ixabiso elipheleleyo lesisombululo esithe nkqo nalo liphezulu kunelo isisombululo se-flip-chip.
I-P0.6-P0.3: Intsikelelo yeendlela ezimbini eziphambili zobugcisa
Kwizicelo ze-P0.6-P0.3, i-Lattice igxile kakhulu kwi-Thin Film LED, iteknoloji ye-chip yefilimu encinci ngaphandle kwe-substrate, ehlanganisa isakhiwo esithe nkqo kunye ne-flip chip structure.Ifilimu encinci ye-LED ngokubanzi ibhekisa kwifilimu encinci ye-LED chip ehluthwe kwi-substrate.Emva kokuba i-substrate ihlulwe, i-substrate entsha inokudibaniswa okanye isakhiwo esithe nkqo singenziwa ngaphandle kokubopha i-substrate.Ibizwa ngokuba nkqo ifilimu ebhityileyo, okanye iVTF ngokufutshane.Kwangaxeshanye, inokwenziwa ibe yi-flip-chip structure ngaphandle kokubophelela i-substrate, ebizwa ngokuba yifilim film flip chip, okanye i-TFFC ngokufutshane.
Indlela yobugcisa 1: Itshiphu ye-VTF/TFFC + i-quantum dot ukukhanya okubomvu (QD + blue light InGaN LED)
Ngaphantsi kobukhulu be-chip encinci kakhulu, i-AlGaInP ebomvu ye-LED ineempawu ezimbi zoomatshini emva kokuba i-substrate isusiwe, kwaye kulula kakhulu ukuyiqhawula ngexesha lenkqubo yokudlulisa, okwenza kube nzima ukwenza imveliso yobuninzi elandelayo.Ke ngoko, esinye isisombululo kukusebenzisa ukuprinta, ukutshiza, ukuprinta kunye nobunye ubuchwepheshe ukubeka amachaphaza e-quantum kumphezulu we-GaN blue LEDs ukufumana ii-LED ezibomvu.
Indlela yoBugcisa yesi-2: Ii-InGaN LEDs zisetyenziswa kuyo yonke imibala yeRGB
Ngenxa yokungonelanga kwamandla omatshini wokukhanya okubomvu okukhoyo kwe-quaternary emva kokususa i-substrate, kunzima ukuphumeza ukuveliswa kwenkqubo elandelayo.Esinye isisombululo kukuba imibala emithathu ye-RGB yonke i-InGaN LEDs, kwaye kwangaxeshanye iqonda ukuhlanganiswa kwe-epitaxy kunye nokuveliswa kwe-chip.Ngokweengxelo, uJingneng uqalise uphando kunye nophuhliso lokukhanya okubomvu kwe-gallium nitride kwi-silicon substrates, kwaye ezinye iimpumelelo zenziwe kwi-silicon-based InGaN ukukhanya okubomvu kwe-LEDs, okwenza ukuba kwenzeke kule teknoloji.
Kuyaphawuleka ukuba, ngokuthelekisa iingenelo kunye nokungalunganga kwe-TFFC, i-FC, kunye ne-Micro chips ngokubhekiselele kwi-substrate, ukuhlukana kwe-chip, ukukhanya okukhanyayo, kunye nokudluliselwa kwezinto ezininzi, i-Lattice yafikelela kwisigqibo: usebenzisa indlela ye-Micro yobugcisa kunye ne-Lattice's Indibaniselwano Iitshiphusi ezincinci zinokunciphisa kakhulu iindleko zetshiphu ngelixa zinciphisa ubunzima bobugcisa.Oku kuthetha ukuba i-4K kunye ne-8K Mini ye-ultra-high-definition ye-LED yeemveliso ezinkulu zesikrini kulindeleke ukuba zingene kumawakawaka amakhaya.
Okwangoku, i-4K kunye ne-8K Mini i-ultra-high-definition ibonisa izikrini ezinkulu ezingenakunqandwa ziqhutywa yi-teknoloji ye-5G, kunye ne-silicon substrate ethe nkqo yee-chips ze-Mini LED zinethuba lokuba sisisombululo sokukhanya esinexabiso eliphezulu.
Ixesha lokuposa: Nov-18-2022