Iphakeji ye-LED yamandla i-PCB isebenza njengesithwali sokushisa nomoya, futhi ukuqhutshwa kwayo okushisayo kudlala indima ebalulekile ekulahlekeni kokushisa kwe-LED.DPC ye-ceramic PCB ikhombisa ukuncintisana okuqinile phakathi kwezinto eziningi zokupakisha ze-elekthronikhi ngokusebenza kwayo okuhle kakhulu kanye nentengo eyancipha kancane kancane. , okuwumkhuba wokuthuthukiswa kokupakishwa kwe-LED yamandla esikhathini esizayo.Ngokuthuthuka kwesayensi nobuchwepheshe kanye nokuvela kwezinqubo ezintsha zokulungiselela, izinto zokwakha ze-ceramic ze-thermal conductivity zinethuba elibanzi lokufaka isicelo njengezinto ezintsha ze-PCB zokupakishwa nge-elekthronikhi.
Ngokuthuthukiswa okuqhubekayo kwamandla okufakwayo ama-chips e-LED, ukushisa okukhulu okukhiqizwe amandla amakhulu okulahla kubeke phambili izidingo ezintsha neziphakeme zezinto zokupakisha ze-LED.Esiteshini sokukhipha ukushisa kwe-LED, i-PCB yokupakisha iyisixhumanisi esiyisihluthulelo esixhuma izindlela zokukhipha ukushisa kwangaphakathi nangaphandle, futhi inemisebenzi yesiteshi sokushabalalisa ukushisa, ukuxhuma kwesekethe nokusekelwa ngokomzimba kwe-chip.Okwamandla aphezuluImikhiqizo ye-LED, i-PCB yokupakisha idinga ukufakwa kukagesi okuphezulu, ukuqhutshwa kwe-thermal okuphezulu, kanye ne-coefficient yokwandisa okushisayo okuhambisana ne-chip.
Kepha iphakethe le-PCB elisuselwa ku-resin: izindleko eziphakeme zokusekela kusenzima ukuzazisa.I-EMC ne-SMC inezidingo eziphezulu zemishini yokubumba yokucindezelwa.Intengo yomugqa wokukhiqiza wokubumba wokucindezelwa icishe ibe yizigidi eziyi-10 zamayuan, futhi kusenzima ukuyidumela ngezinga elikhulu.Abakaki be-SMD LED abavele eminyakeni yamuva ngokuvamile basebenzisa izinto zepulasitiki zobunjiniyela eziguquguquke kakhulu, zisebenzisa i-PPA resin njengempahla eluhlaza, futhi bengeza izigcwalisi eziguquliwe ukuze kuthuthukiswe izici ezithile zomzimba namakhemikhali we-PPA eluhlaza, ukuze izinto ze-PPA zifaneleke kangcono. ukubumba umjovo.Futhi ukusetshenziswa SMD ubakaki LED.I-thermal conductivity yepulasitiki ye-PPA iphansi kakhulu, nokushisa kwayo
ukuchithwa kwenziwa ngokuyinhloko ngohlaka lwensimbi lokuhola.Umthamo wokukhipha ukushisa unomkhawulo, futhi ulungele kuphela ukupakishwa kwe-LED enamandla aphansi.
I-Metal Core Printed Circuit Boards: Izinqubo Eziyinkimbinkimbi Zokukhiqiza kanye Nezicelo Ezingasebenzi Kancane.Inqubo yokucubungula nokukhiqiza ye-PCB esekwe ku-aluminium iyinkimbinkimbi futhi izindleko ziphezulu.I-coefficient yokwandisa okushisayo ye-aluminium ihluke kakhulu kuleyo ye-chip material, futhi ayivamisile ukusetshenziswa ezinhlelweni zokusebenza.Iningi lamaphakeji e-LED anamandla aphezulu asebenzisa lolu hlobo lwe-PCB, futhi intengo iphakathi kwenani eliphakathi nendawo eliphezulu.IlungeleIsibonisi se-LED MINI.I-PCB yamanje yokushisa ukushisa kwe-LED enamandla amakhulu ekukhiqizeni ine-conductivity ephansi kakhulu yokushisa kwesendlalelo se-insulating, futhi ngenxa yokuba khona kwesendlalelo se-insulating, ayikwazi ukumelana nokushisa okuphezulu kokushisa, okukhawulela ukwenziwa kahle kwesakhiwo sephakheji futhi ayihambisani nokuchithwa kokushisa kwe-LED.
I-PCB yokupakisha esekelwe ku-silicon: ebhekene nezinselele, izinga lokukhiqiza lingaphansi kuka-60%.Ama-PCB asekelwe ku-silicon abhekana nezinselele ekulungiseleleni izingqimba ezivikelayo, izendlalelo zensimbi, nama-vias, futhi izinga lokukhiqiza alidluli u-60%.Izinto ezisekelwe ku-silicon zisetshenziswa njengobuchwepheshe be-PCB bokupakisha be-LED, obusetshenziswa ku-Imboni ye-LEDembonini ye-semiconductor.I-thermal conductivity kanye nezakhiwo zokunweba ezishisayo zama-PCB asekelwe ku-silicon zibonisa ukuthi i-silicon iyinto efanelekile yokupakisha yama-LED.I-conductivity ye-thermal
I-silicon ingu-140W/m·K.Uma isetshenziswe ekufakweni kwe-LED, ukumelana nokushisa okubangelwa yi-0.66K / W kuphela;kanye nezinto ezisekelwe ku-silicon zisetshenziswe kabanzi ezinqubweni zokukhiqiza ze-semiconductor kanye nezinkambu zokupakisha ezihlobene, ezibandakanya imishini ehlobene nezinto zokwakha.uvuthiwe impela.Ngakho-ke, uma i-silicon yenziwe kwiphakheji ye-LED ye-PCB, ukukhiqizwa ngobuningi kulula.Noma kunjalo, kusenezinkinga eziningi zobuchwepheshe ekufakweni kwe-silicon PCB ye-LED.Isibonelo, ngokwezinto zokwakha, izinto ze-silicon ziphuka kalula, futhi kunenkinga ngamandla omshini.Ngokuya ngesakhiwo, nakuba i-silicon ingumqhubi omuhle kakhulu wokushisa, inokweqa okungalungile futhi kufanele ifakwe i-oxidized futhi ifakwe insulated.Ngaphezu kwalokho, ungqimba lwensimbi ludinga ukulungiswa ngokufafaza kuhlanganiswe ne-electroplating, futhi imbobo yokuhambisa idinga ukulungiswa ngokuqopha.Ngokuvamile, ukulungiswa kwe-insulating layers, izendlalelo zensimbi, kanye ne-vias zonke zibhekana nezinselele, futhi isivuno asiphezulu.
I-Ceramic Package PCB: Thuthukisa Ukusebenza Kokuqeda Ukushisa Ukuze UhlanganeI-LED enamandla amakhuluIzimfuno.Nge-matrix ye-ceramic ye-thermal conductivity ephezulu, ukusebenza kahle kokukhipha ukushisa kuthuthukiswa kakhulu, futhi kuwumkhiqizo ofaneleka kakhulu wezidingo zokuthuthukiswa kwamandla aphezulu kanye nama-LEDs amancane.I-Ceramic PCBS inezinto ezintsha ze-thermal conductivity kanye nezakhiwo ezintsha zangaphakathi, ezakha ukukhubazeka kwe-aluminium yensimbi ye-PCBS, ngaleyo ndlela ithuthukise umphumela wokushisa ophelele we-PCB.Phakathi kwezinto ze-ceramic ezingasetshenziselwa ukushisa ukushisa kwe-PCB, i-BEO ine-conductivity ephezulu ye-thermal, kodwa i-coefficient yayo yokwandisa umugqa ihluke kakhulu ku-silicon, futhi inobuthi ngesikhathi sokukhiqiza, okunciphisa ukusetshenziswa kwayo;I-BN inokusebenza okuhle okuphelele, kodwa njenge-PCB Impahla ayinazo izinzuzo ezivelele futhi iyabiza, futhi okwamanje isekucwaningweni nasekukhuthazeni kuphela;I-silicon carbide inamandla aphezulu kanye ne-thermal conductivity ephezulu, kodwa ukumelana kwayo kanye ne-dielectric ukumelana ne-voltage kuphansi, futhi ukubopha ngemva kwe-metallization akuzinzile, okuzobangela Izinguquko ekuziphatheni okushisayo kanye nokungaguquki kwe-dielectric akufanele kusetshenziswe njengezinto zokupakisha ze-PCB zokuvala.Nakuba i-Al2O3 substrate ye-ceramic okwamanje iyi-substrate ye-ceramic ekhiqizwa kakhulu futhi esetshenziswa kabanzi, ngenxa ye-coefficient yayo ephezulu yokwandisa okushisayo kunaleyo ye-Si single crystal, i-Al2O3 substrate ye-ceramic ayifanele i-high-frequency, amandla aphezulu, i-ultra-scale-scale ehlanganisiwe. izifunda.isetshenziswe ngaphakathi. Ikristalu ye-A1N inokushintshwa okushisayo okuphezulu futhi ibhekwa njengento efanelekile yesizukulwane esilandelayo semiconductor PCBS kanye nokupakishwa.
I-AlN ceramic PCB iye yafundwa kabanzi futhi yathuthukiswa kancane kancane kusukela ngawo-1990.Njengamanje ngokuvamile ibhekwa njengento ethembisayo yokufakwa kwe-ceramic ye-ceramic.Ukusebenza kahle kokushabalalisa ukushisa kwe-AlN ceramic PCB cishe izikhathi eziyisi-7 kunalokho kwe-Al2O3.Inzuzo yokuqeda ukushisa ye-AlN ceramic PCB esetshenziswa kuma-LED anamandla aphezulu iyamangalisa, ngaleyo ndlela ithuthukisa kakhulu impilo yesevisi yama-LED.I-DPC Ceramic PCB yaziwa nangokuthi ibhodi le-ceramic eqondile yethusi.Imikhiqizo ye-DPC inezici zokunemba kwesekethe ephezulu kanye nokugcwala komhlaba okuphezulu.Iwumkhiqizo ovela kwamanye amazwe ofaneleka kakhulu izidingo zokuthuthukiswa kwamandla aphezulu, ama-LED anosayizi omncane.
Isikhathi sokuthumela: Aug-29-2022