Iphakeji ye-LED ye-PCB yamandla isebenza njengomthwali wobushushu kunye nokuhanjiswa komoya, kwaye ukuqhutyelwa kwayo kwe-thermal kudlala indima ecacileyo ekutshitshisweni kobushushu be-LED.DPC ye-ceramic PCB ibonisa ukhuphiswano olunamandla phakathi kwezinto ezininzi zokupakisha ze-elektroniki kunye nokusebenza kwayo okugqwesileyo kunye nokuhla kancinci kwexabiso. , nto leyo yindlela yokuphuhlisa ukupakishwa kwe-LED yamandla kwixesha elizayo.Ngophuhliso lwenzululwazi kunye nobuchwepheshe kunye nokuvela kweenkqubo ezintsha zamalungiselelo, izixhobo ze-ceramic conductivity eziphezulu ze-thermal zinethuba elibanzi lokusebenzisa njengezinto ezintsha zokupakisha nge-elektroniki zePCB.
Ngophuculo oluqhubekayo lwamandla egalelo lee-chips ze-LED, ubushushu obukhulu obuveliswa ngamandla amakhulu okutshabalalisa bubeke phambili iimfuno ezintsha neziphezulu zemathiriyeli yokupakisha ye-LED.Kwi-channel ye-LED yokutshatyalaliswa kobushushu, i-PCB yokupakisha iyikhonkco engundoqo edibanisa iindlela zangaphakathi nangaphandle zokutshatyalaliswa kobushushu, kwaye inemisebenzi yejelo lokutshatyalaliswa kobushushu, uxhulumaniso lwesekethe kunye nenkxaso yomzimba ye-chip.Ngamandla aphezuluIimveliso ze-LED, i-PCB yokupakisha ifuna ukugqunywa kombane okuphezulu, ukuguquguquka okuphezulu kwe-thermal, kunye ne-coefficient yokwandisa i-thermal ehambelana ne-chip.
Kodwa i-PCB esekwe kwi-resin: ixabiso eliphezulu lokuxhasa kusenzima ukuba lidume.I-EMC kunye ne-SMC zineemfuno eziphezulu kwisixhobo sokubumba ucinezelo.Ixabiso lomgca wemveliso yokubumba i-compression malunga ne-10 yezigidi ze-yuan, kwaye kusenzima ukuyivakalisa ngomlinganiselo omkhulu.Izibiyeli ze-SMD ze-LED eziye zavela kwiminyaka yamva nje zisebenzisa izixhobo zeplastiki zobunjineli ezinobushushu obuphezulu, zisebenzisa i-PPA resin njengezinto ezikrwada, kunye nokongeza izihluzi eziguquliweyo zokuphucula iipropathi ezithile zomzimba kunye neekhemikhali zemathiriyeli ekrwada yePPA, ukuze imathiriyeli yePPA ilunge ngakumbi isitofu sokubumba.Kunye nokusetyenziswa kwe-SMD isibiyeli se-LED.I-thermal conductivity ye-PPA yeplastiki iphantsi kakhulu, kunye nobushushu bayo
ukuchithwa kuqhutyelwa ikakhulu ngesakhelo esikhokelela kwintsimbi.Umthamo wokutshatyalaliswa kobushushu ulinganiselwe, kwaye ufanelekile kuphela ukupakishwa kwe-LED enamandla aphantsi.
Iibhodi zeSekethe eziShicileleyo zeMetal: Iinkqubo eziNxibelele zokwenziwa koMveliso kunye nezicelo eziNcincisayo.Inkqubo yokwenziwa kunye nokuveliswa kwe-PCB esekwe kwi-aluminium inzima kwaye ixabiso liphezulu.I-coefficient yokwandisa i-thermal ye-aluminium yahluke kakhulu kuleyo ye-chip material, kwaye ayifane isetyenziswe kwizicelo eziphathekayo.Uninzi lweepakethi ze-LED ezinamandla aphezulu zisebenzisa olu hlobo lwePCB, kwaye ixabiso liphakathi kwexabiso eliphakathi kunye neliphezulu.IlungeleUmboniso we-MINI we-LED.I-PCB yangoku ephezulu yamandla e-LED yokutshatyalaliswa kobushushu kwimveliso ine-conductivity ephantsi kakhulu ye-thermal ye-insulating layer, kwaye ngenxa yobukho be-insulating layer, ayikwazi ukumelana nobushushu obuphezulu be-soldering, obunqanda ukulungiswa kwesakhiwo sephakheji kwaye ayihambisani nokutshatyalaliswa kobushushu be-LED.
I-PCB yokupakisha esekelwe kwi-silicon: ejongene nemingeni, izinga lesivuno lingaphantsi kwe-60%.I-PCB esekelwe kwi-silicon ijongene nemingeni ekulungiseleleni i-insulating layers, i-metal layers, kunye ne-vias, kwaye izinga lesivuno alidluli i-60%.Izinto ezisekelwe kwi-silicon zisetyenziswa njengeteknoloji ye-PCB yokupakisha ye-LED, esetyenziswa kwi-Ishishini le-LEDkushishino lwesemiconductor.I-thermal conductivity kunye nepropathi yokwandiswa kwe-thermal ye-silicon-based PCB ibonisa ukuba i-silicon yinto efanelekileyo yokupakisha ii-LEDs.I-thermal conductivity
yesilicon yi-140W/m·K.Xa isetyenziselwa ukupakishwa kwe-LED, ukuchasana kwe-thermal okubangelwa yi-0.66K / W kuphela;kunye nezinto ezisekelwe kwi-silicon zisetyenziswe ngokubanzi kwiinkqubo zokuvelisa i-semiconductor kunye neendawo zokupakisha ezinxulumene nazo, ezibandakanya izixhobo ezinxulumeneyo kunye nezixhobo.uqole kakhulu.Ke ngoko, ukuba i-silicon yenziwe kwiphakheji ye-LED yePCB, ukuveliswa kobuninzi kulula.Nangona kunjalo, kusekho iingxaki ezininzi zobugcisa kwi-LED ye-silicon PCB yokupakisha.Ngokomzekelo, ngokwezinto eziphathekayo, izinto ze-silicon ziphulwa ngokulula, kwaye kukho ingxaki ngamandla omatshini.Ngokumalunga nolwakhiwo, nangona i-silicon iyi-conductor egqwesileyo ye-thermal, ine-insulation embi kwaye kufuneka ifakwe i-oxidized kunye ne-insulated.Ukongezelela, i-metal layer kufuneka ilungiswe ngokutshiza idityaniswe ne-electroplating, kwaye umngxuma oqhubekileyo kufuneka ulungiswe ngokufaka i-etching.Ngokubanzi, ukulungiswa kwemigangatho yokugquma, iileya zetsimbi, kunye ne-vias yonke imingeni yokujongana, kwaye isivuno asiphezulu.
I-PCB yeCeramic Package: Ukuphucula ukuSebenza kokuThuthwa kobushushu ukuze kuhlangatyezwaneI-LED enamandla amakhuluIimfuno.Ngomgangatho ophezulu we-thermal conductivity ceramic matrix, ukusebenza kakuhle kokutshatyalaliswa kobushushu kuphuculwe kakhulu, kwaye yeyona mveliso ifanelekileyo kwiimfuno zophuhliso lwamandla aphezulu kunye nobukhulu obuncinci be-LEDs.I-PCBS yeCeramic inezixhobo ezintsha zokuqhuba i-thermal kunye nezakhiwo ezitsha zangaphakathi, ezenza iziphene ze-PCBS yesinyithi ye-aluminium, ngaloo ndlela kuphuculwe umphumo wokutshatyalaliswa kobushushu be-PCB.Phakathi kwezinto ze-ceramic ezingasetyenziselwa ukutshatyalaliswa kokushisa kwe-PCB, i-BEO ine-conductivity ephezulu ye-thermal, kodwa i-coefficient yayo yokwandisa i-linear ihluke kakhulu kuleyo ye-silicon, kwaye inetyhefu ngexesha lokwenziwa, elikhawulela isicelo sayo;I-BN inomsebenzi omhle obanzi, kodwa njenge-PCB Izinto eziphathekayo azikho iinzuzo ezibalaseleyo kwaye ziyabiza, kwaye okwangoku kuphela kuphando kunye nokukhuthazwa;I-silicon carbide inamandla aphezulu kunye ne-thermal conductivity ephezulu, kodwa ukuxhathisa kwayo kunye ne-dielectric ukumelana ne-voltage iphantsi, kwaye i-bonding emva kwe-metallization ayizinzanga, okuya kubangela Utshintsho kwi-thermal conductivity kunye ne-dielectric constant akufanele isetyenziswe njenge-insulating packaging PCB.Nangona i-Al2O3 i-ceramic substrate ngoku iyeyona iveliswa kakhulu kwaye isetyenziswa ngokubanzi kwi-ceramic substrate, ngenxa yokwandiswa kwayo okuphezulu kwe-thermal kune-crystal ye-Si single, i-Al2O3 i-substrate ye-ceramic ayifanelekanga kwi-high-frequency, high-power, ultra-large-scale ehlanganisiweyo. iisekethe.isetyenziswe kwi-A1N crystal ine-conductivity ephezulu ye-thermal kwaye ithathwa njengento efanelekileyo kwisizukulwana esilandelayo se-semiconductor PCBS kunye nokupakishwa.
I-AlN ceramic PCB iye yafundwa ngokubanzi kwaye yaphuhliswa ngokuthe ngcembe ukususela ngo-1990.Okwangoku ithathwa ngokuba yinto ethembisayo ye-elektroniki yokupakisha i-ceramic.Ukusebenza kokuchithwa kobushushu kwe-AlN ceramic PCB kufana namaxesha e-7 e-Al2O3.Inzuzo yokutshatyalaliswa kobushushu ye-AlN ceramic PCB esetyenziswe kwii-LED eziphezulu zamandla iyamangalisa, ngaloo ndlela iphucula kakhulu ubomi benkonzo yee-LED.I-DPC ye-ceramic PCB ikwabizwa ngokuba yibhodi ye-ceramic ethe ngqo yobhedu.Iimveliso ze-DPC zineempawu zokuchaneka kwesekethe ephezulu kunye ne-flatness ephezulu.Yimveliso enqamlezileyo efanelekileyo kakhulu kwiimfuno zophuhliso lwamandla aphezulu, ama-LED amancinci.
Ixesha lokuposa: Aug-29-2022