Esikhathini sokuboniswa kwe-micro-pitch, kusenezinselele eziningi zobuchwepheshe zokuthuthukisa ikhwalithi yesithombe
As I-Micro-LEDingena enkathini entsha, abathengi nabo babeke phambili izidingo eziphakeme zekhwalithi yesithombe esibonisiwe.Indlela yokuthuthukisa ikhwalithi yesithombe esibonisiwe isiphenduke inkomba ebalulekile yocwaningo nentuthuko yezinkampani zesikrini.Kusukela ngekhulunyaka lama-21, ukuvela kobuchwepheshe bemboni yokubonisa i-LED abukathuthuki ngokuphelele ngokuvumelana nomthetho ka-Heitz.
Umkhuba wokuthuthukiswa kobuchwepheshe bemboni yokubonisa i-LED ngokuyinhloko ukuthi i-chip iyaqhubeka nokuncipha futhi iphikseli pitch iyaqhubeka nokuya phansi;izindleko ze-chip eyodwa ye-LED ziyaqhubeka nokuncipha futhi ukukhanya kuyaqhubeka kukhuphuka; Qhubeka uhlole izingxenye ezintsha zohlelo lokusebenza, ikakhulukazi uhlangothi lwebhizinisi kanye nemakethe ekhombisa uhlangothi lukahulumeni itholakala yonke indawo.Umkhiqizi wesibonisi we-LED, ukuze ukwazi kahle ubuchwepheshe obuyinhloko bokuboniswa kobukhulu obukhulu be-Mini/Micro-LED, kunezici ezintathu: eyodwa iwukwenza umsebenzi omuhle emikhiqizweni yayo yehadiwe, okwesibili ukuba nesistimu yokulawula, kanti eyesithathu iwukuba ujwayelene namakhasimende esigabeni semakethe yohlelo lokusebenza.I-Logic yokuletha ukuhlanganiswa kwe-LED emakethe.
I-chip yokulawula uhlelo, okubaluleke kakhulu, ukulungiswa kwe-optical kanye nesistimu yokulawula.I-Micro-LED iyindlela engcono kakhulu, kodwa futhi ibhekana nezinselele eziningi zobuchwepheshe: isibonelo, 1. I-Chip miniaturization inciphisa ukusebenza kahle okukhanyayo kwe-chip eyodwa futhi yandisa ukukhiqizwa kokushisa;2. Ukwenziwa kwe-chip miniaturization kuletha izinguquko ekuhambisaneni kokukhishwa kokukhanya kwe-chip ngaphansi kokusebenza kwamanje okuphansi.Abampofu;3. I-optical crosstalk phakathi kwamaphikseli aseduze ibucayi;4. Izindleko zokuhlolwa kwe-chip sub-test zikhuphuke kakhulu, futhi ama-Micro-LED chips awakwazi ngisho nokufinyelela ukuhlolwa kwe-EL;Uthuli nezinhlayiya kunomthelela omkhulu ku-engeli ekhipha ukukhanya, futhi kuvimbe nokukhishwa kokukhanya kwe-chip ukuze kube "iphikseli efile ekhipha ukukhanya";6. I-chip miniaturization iletha ukwanda okukhulu kwezindleko zokulungisa amaphikseli kanye nezindleko zangemuva kwesevisi.Isibonelo, iklayenti le-COB cishe akunakwenzeka ukulilungisa, kuphela Buyela kumkhiqizi wesibonisi.
I-Min-LEDkanye nobuchwepheshe be-Micro-LED buye benza izinguquko ezinkulu.Esokuqala ukunemba okuphezulu, ukudluliswa okunembayo okuphezulu kanye nobuchwepheshe bokubopha ama-chips amancane, ukutholwa okunemba okuphezulu nokulungisa ubuchwepheshe be-small-
amashiphu osayizi, kanye nobuchwepheshe bokushayela nokulungisa obusekelwe kumanje omncane;Ubuchwepheshe bokupakisha kanye nezinto ezibonakalayo, ubuchwepheshe bokulawula isibonisi obudidiyelwe kakhulu;ekugcineni, ubuchwepheshe bokukhiqiza umbala obunembile (umbala) bezindinganiso ezihlukile zokubonisa umbala we-gamut, ubuchwepheshe bokucubungula obumpunga obuphakeme (ukucubungula okumpunga) okusekelwe kumajika e-PQ noma e-HLG wamazinga ahlukene e-HDR , Ubuchwepheshe bokucubungula ikhwalithi yesithombe esinyakazayo buphelele (i-algorithm).
Esikhathini sokuboniswa kwe-micro-pitch, ungaphinda uqonde futhi uchaze ikhwalithi yesithombe?U-Shi Changjin ukholelwa ukuthi kufanele kube nokuthuthuka okuthile ku-grayscale ephezulu, umbala obanzi we-gamut, ukuvuselela okuphezulu, nokuvumelana okumhlophe okuphezulu.Isibonelo, i-grayscale ephezulu + ukukhanya okuphezulu okuphezulu kungafinyelela ububanzi obuguquguqukayo obuphezulu;okwesibili, i-gamut yombala obanzi + i-angle yokubuka ye-ultra-wide, ithuthukisa ukuhambisana kwama-engeli amakhulu wokubuka;okwesithathu, ukuvuselela okuphezulu + izinga eliphezulu lozimele, ukuzuza imiphumela engcono yezithombe ezinyakazayo, ukungaguquguquki okumhlophe okuphezulu + ukungaguquguquki okumnyama, kuqinisekisa okungcono Umphumela wokubonisa umthombo wokukhanya ongaphezulu.
Esikhathini sokupakishwa okuhlanganisiwe, ukubaluleka kokumnyama kuphakeme kakhulu kunokwenkathi yendabuko ye-SMD.Isibonelo, uma umbala omnyama ongaphezulu ungaphathwa kahle, isenzakalo se-mosaic emnyama sizobonakala kakhulu.I-SMD yakhiwe ama-LED amaningi ahlukene, ngoba ukuhlakazeka kokukhanya kwenza buthaka lo mphumela we-modular wesikrini esimnyama.Ngaphezu kwalokho, kukhona ukukhanya okubonakalayo okuzokwenza isikrini sibe isibuko.Ukubonisana okukhethekile kungathunaza kakhulu ikhwalithi yesithombe uma ukukhanya kwe-ambient kunamandla.
Isikhathi sokuthumela: Jun-24-2022